Tin-lead solder paste with flux MECHANIC XG-Z40 (XG-Z40)
Description Tin-lead solder paste with flux MECHANIC XG-Z40
Tin-lead solder paste with flux MECHANIC XG-Z40
Ideal for bead recovery on BGA chip / NAND chip / SMD soldering
Composition: Sn-63%, Pb-37%, SN(tin) BP (lead)
Solder particle size: 25 - 45um
Melting point: 183°C
Residues do not require washing
Packing: 35 grams
dosing needle included (color may vary from lot to lot)
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